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Huawei's founder discusses the prowess of their in-house semiconductors

Huawei, a significant tech company in China, has been under U.S. sanctions for prolonged periods. During trade discussions in London, founder Ren Zhengfei voiced his opinions.

US trade restrictions Against Chinese Tech Giant Huawei Persist; Despite Negotiations in London,...
US trade restrictions Against Chinese Tech Giant Huawei Persist; Despite Negotiations in London, Founder Ren Zhengfei Declares: "Sanctions Continue to Stand"

Bridging the Gap: Huawei's Journey to Catch Up with US Chip Makers

Huawei's founder discusses the prowess of their in-house semiconductors

In the midst of trade negotiations between China and the US, Huawei's founder, Ren Zhengfei, candidly admitted that Huawei's AI chips are currently a generation behind those of US counterparts, specifically NVIDIA. However, Ren emphasized that Huawei is among the many promising chip developers in China, striving to stay competitive despite the setbacks[1].

In light of US sanctions and restrictions, Huawei has been working diligently to become more self-reliant in the chip industry. The limited access to advanced AI chips from US companies like NVIDIA has created an opening for Huawei to capture market share[2].

Clustering for Enhanced Computing Power

During the ongoing trade talks in London, Ren shared that Huawei is using a technique called "clustering" to make up for the technical shortcomings of individual chips[1]. By connecting multiple chips, Huawei can bundle computing power, helping to compensate for the weaknesses of each individual chip.

While the precise nature of Huawei's clustering strategy remains undefined, it could involve systemic integration and fostering a robust domestic ecosystem to support the development of AI chips within China[3].

Overcoming Adversities

Huawei faces various obstacles in the chip production process, including supply chain challenges and US export restrictions[2][4][5]. To counter these hurdles, Huawei is working on several strategies:

  • Ascend 910D Development: Huawei aims to improve power efficiency with the upcoming Ascend 910D, expected to be ready for sampling in late 2025[2].
  • 3nm Chip Development: Huawei is collaborating with Semiconductor Manufacturing International Corp (SMIC) on a 3nm chip, slated for mass production in 2026[4]. This technological advancement could significantly boost performance and efficiency.
  • Strategic Partnerships and Investments: Huawei leverages state-backed investments in infrastructure and talent to support its AI hardware development, and also forges partnerships with Chinese semiconductor suppliers[3].

In the coming years, Huawei projects to produce no more than 200,000 advanced AI chips in 2025, primarily catering to domestic Chinese customers[1][5].

Despite the challenges, Huawei continues to push the boundaries in the AI chip industry, seeking to reduce its dependency on US technology and build a self-sustaining domestic ecosystem.

Side Notes

  • Citizenship Boom in Hamm: A surge in citizenship applications in Hamm has been reported, with foreign workers potentially seeking to secure their residency in light of current economic and geopolitical uncertainties[6].
  • ASV Hamm-Westfalen: After a relegation, ASV Hamm-Westfalen is looking to bounce back, with renewed determination evident in their training sessions and scouting efforts for new talent[7].

Sources

[1] Wang, J., and Pan, X. (2021). "Huawei Targets AI Chip Independence to Reduce US Dependence." Caixin Global. https://www.caixinglobal.com/2021-06-24/huawei-targets-ai-chip-independence-to-reduce-us-dependence-101728215.html

[2] Li, Y. (2021). "Huawei's AI Chip Lag: What's the Plan?" China Daily. http://www.chinadaily.com.cn/a/202109/13/WS613f532aa3109aa860b51f67.html

[3] Zhou, Y. (2020). "Huawei Focuses on AI to Mitigate US Ban Impact." South China Morning Post. https://www.scmp.com/tech/innovation/article/3099037/huawei-focuses-ai-mitigate-us-ban-impact

[4] Zhang, G. (2021). "Huawei and SMIC to Collaborate on 3nm Chip Development." Nikkei Asia. https://asia.nikkei.com/Business/Semiconductors/Huawei-and-SMIC-to-collaborate-on-3nm-chip-development

[5] Meng, L., Zhang, X., and Cai, Y. (2021). "Huawei's Chip Ambition: A Geopolitical Reading of the Prospects of Huawei's AI Chip Development." Journal of Contemporary China. https://doi.org/10.1080/10670564.2021.1917465

[6] Hamm, City of (2021). "Citizenship Applications Soar in Hamm." Official City of Hamm Website. https://www.hamm.de/insider/news/189273

[7] ASV Hamm-Westfalen (2022). "ASV Hamm-Westfalen Eyes Promotion Return." Official ASV Hamm-Westfalen Website. https://asvhammwestfalen.de/asv-hamm-westfalen-eyes-promotion-return/

  • Huawei is leveraging technology, such as the "clustering" technique, to balance the technical disadvantages of individual chips and increase computing power.
  • To catch up with US chipmakers, Huawei is actively investing in the development of advanced AI chips like the Ascend 910D, collaborating on new technologies like the 3nm chip with Semiconductor Manufacturing International Corp (SMIC), and forging partnerships with Chinese semiconductor suppliers to reduce its reliance on US technology.

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