Huawei Unveils Next-Gen Ascend Chips for AI Boost
Huawei has unveiled its roadmap for the next generation of Ascend chips, promising significant improvements in performance and efficiency. The company's Rotating Chairman, Eric Xu, shared details at Huawei Connect 2025 in Shanghai. The new series, comprising the Ascend 950, 960, and 970, will offer enhanced vector processing and granular memory access.
The Ascend 950, set to be released in Q4 2026, will process 128 byte chunks and offer twice the computing power, memory access bandwidth, and memory capacity of its predecessor, the Ascend 910C. In Q1 2026, the Ascend 950PR will be available, followed by the Ascend 950DT in Q4 2026. These chips will support low-precision data formats like FP8, delivering up to 2 PFLOPs of performance.
The Ascend 960, slated for Q4 2027, will further boost performance, offering twice the computing power, memory access bandwidth, and memory capacity of the 950. Looking ahead to the end of 2028, the Ascend 970 will boast an interconnect bandwidth of 4TB/s and deliver 8 PFLOPs of FP4 performance.
Huawei will also release SuperPods of NPUs, starting with the Atlas 950 SuperPod in Q4 2026, packed with Ascend 950DT chips. Additionally, the company plans to release two models of its Kunpeng 950 processors in early 2026, with 96 cores & 192 threads or 192 cores & 384 threads. The world's first general-purpose computing SuperPod, the Kunpeng 950-based TaiShan 950, is also planned for early 2026.
Huawei's upcoming Ascend chip series promises substantial advancements in processing power and efficiency. With the release of the Ascend 950, 960, and 970, along with SuperPods and Kunpeng processors, the company is set to strengthen its position in the AI and high-performance computing markets. These developments are expected to drive innovation and competition in the tech industry.
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